WO2005123387A3 - Electro-active adhesive systems - Google Patents

Electro-active adhesive systems Download PDF

Info

Publication number
WO2005123387A3
WO2005123387A3 PCT/US2005/020168 US2005020168W WO2005123387A3 WO 2005123387 A3 WO2005123387 A3 WO 2005123387A3 US 2005020168 W US2005020168 W US 2005020168W WO 2005123387 A3 WO2005123387 A3 WO 2005123387A3
Authority
WO
WIPO (PCT)
Prior art keywords
electro
active
active adhesive
adhesive
adherends
Prior art date
Application number
PCT/US2005/020168
Other languages
French (fr)
Other versions
WO2005123387A2 (en
Inventor
Charles W Extrand
Original Assignee
Entegris Inc
Charles W Extrand
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Charles W Extrand filed Critical Entegris Inc
Publication of WO2005123387A2 publication Critical patent/WO2005123387A2/en
Publication of WO2005123387A3 publication Critical patent/WO2005123387A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3604Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint
    • B29C65/3608Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements
    • B29C65/3612Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the type of elements heated by induction which remain in the joint comprising single particles, e.g. fillers or discontinuous fibre-reinforcements comprising fillers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/487Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
    • B29C65/4875Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3672Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint
    • B29C65/3676Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being metallic
    • B29C65/368Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being metallic with a polymer coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • B29C65/3672Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint
    • B29C65/3684Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being non-metallic
    • B29C65/3696Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction characterised by the composition of the elements heated by induction which remain in the joint being non-metallic with a coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7316Surface properties
    • B29C66/73161Roughness or rugosity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/006Memory cards, chip cards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Abstract

A method of adhesive bonding by electric field. The method includes providing at least two adherends (24,26) to be bonded, providing an electro-active adhesive (22) between the at least two adherends, wherein the electro-active adhesive includes a multiplicity of electro-active particles and an adhesive binder, and applying an electric field to change the adhesion of the electro-active adhesive system to at least one of the adherends. Various carriers for microelectronic devices including electro-active adhesive contact surfaces are also included within the scope of the invention.
PCT/US2005/020168 2004-06-09 2005-06-09 Electro-active adhesive systems WO2005123387A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US57842204P 2004-06-09 2004-06-09
US60/578,422 2004-06-09
US11/149,085 US20050274455A1 (en) 2004-06-09 2005-06-08 Electro-active adhesive systems
US11/149,085 2005-06-08

Publications (2)

Publication Number Publication Date
WO2005123387A2 WO2005123387A2 (en) 2005-12-29
WO2005123387A3 true WO2005123387A3 (en) 2006-10-12

Family

ID=35459265

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/020168 WO2005123387A2 (en) 2004-06-09 2005-06-09 Electro-active adhesive systems

Country Status (2)

Country Link
US (1) US20050274455A1 (en)
WO (1) WO2005123387A2 (en)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100038121A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US20100040896A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
AU6531600A (en) 1999-08-27 2001-03-26 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US7744002B2 (en) * 2004-03-11 2010-06-29 L-1 Secure Credentialing, Inc. Tamper evident adhesive and identification document including same
KR20080084812A (en) 2005-11-22 2008-09-19 쇼킹 테크놀로지스 인코포레이티드 Semiconductor devices including voltage switchable materials for over-voltage protection
CN100577782C (en) * 2006-06-15 2010-01-06 中国科学院物理研究所 Electric rheologic liquid electrode plate for surface modification
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
EP2084748A4 (en) 2006-09-24 2011-09-28 Shocking Technologies Inc Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same
US20100044376A1 (en) * 2006-11-21 2010-02-25 Gyros Patent Ab Method of bonding a micrifluidic device and a microfluidic device
EP1967422B1 (en) * 2007-03-08 2012-04-18 nolax AG Airbag
CN101669199B (en) * 2007-04-19 2011-06-15 株式会社爱发科 Substrate holding mechanism and substrate assembling apparatus provided with the same
US8628838B2 (en) * 2007-04-20 2014-01-14 GM Global Technology Operations LLC Multilayer thermo-reversible dry adhesives
US8685528B2 (en) * 2007-04-20 2014-04-01 GM Global Technology Operations LLC Shape memory polymer and adhesive combination and methods of making and using the same
US8618238B2 (en) * 2007-04-20 2013-12-31 GM Global Technology Operations LLC Shape memory epoxy polymers
US8012292B2 (en) * 2007-05-23 2011-09-06 GM Global Technology Operations LLC Multilayer adhesive for thermal reversible joining of substrates
US8236129B2 (en) * 2007-05-23 2012-08-07 GM Global Technology Operations LLC Attachment pad with thermal reversible adhesive and methods of making and using the same
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
DE102007038458A1 (en) * 2007-08-14 2009-02-19 Tesa Ag composite element
US8888819B2 (en) * 2007-08-31 2014-11-18 DePuy Synthes Products, LLC Connector for securing an offset spinal fixation element
US7976665B2 (en) * 2007-10-04 2011-07-12 GM Global Technology Operations LLC Method of minimizing residue adhesion for thermo-reversible dry adhesives
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US7897225B2 (en) * 2008-02-19 2011-03-01 Composite Technology Development, Inc. Deformable sandwich panel
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US8343386B2 (en) * 2008-05-21 2013-01-01 International Business Machines Corporation Electrostatic dissipative adhesive
US8107196B2 (en) * 2008-05-21 2012-01-31 International Business Machines Corporation Systems having components coupled with electrostatic dissipative adhesive
US8093340B2 (en) * 2008-07-24 2012-01-10 GM Global Technology Operations LLC High strength reversible noncovalent adhesion methods for a solid polymer-polymer interface
US8865310B2 (en) * 2008-07-29 2014-10-21 GM Global Technology Operations LLC Polymer systems with multiple shape memory effect
US8641850B2 (en) * 2008-07-29 2014-02-04 GM Global Technology Operations LLC Polymer systems with multiple shape memory effect
US8198369B2 (en) * 2008-08-05 2012-06-12 GM Global Technology Operations LLC Shape memory polymers with surface having dangling adhesive polymeric chains and methods of making and using the same
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US9208930B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US8277594B2 (en) * 2008-10-21 2012-10-02 GM Global Technology Operations LLC Self-cleaning dry adhesives
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US8198349B2 (en) 2008-11-18 2012-06-12 GL Global Technology Operations LLC Self-healing and scratch resistant shape memory polymer system
US8057891B2 (en) * 2009-01-26 2011-11-15 GM Global Technology Operations LLC Remote activation of thermo-reversible dry adhesives
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8795464B2 (en) * 2009-02-09 2014-08-05 GM Global Technology Operations LLC Reversible welding process for polymers
US8043459B2 (en) * 2009-02-24 2011-10-25 GM Global Technology Operations LLC Reversible dry adhesives for wet and dry conditions
US8968606B2 (en) 2009-03-26 2015-03-03 Littelfuse, Inc. Components having voltage switchable dielectric materials
WO2010135726A2 (en) * 2009-05-22 2010-11-25 Proteqt Technologies, Inc. Remote-activation lock system and method
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
DE102009055091A1 (en) * 2009-12-21 2011-06-22 tesa SE, 20253 Induction heatable adhesive tape with differential release behavior
US9224728B2 (en) 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9328015B2 (en) * 2010-03-19 2016-05-03 Owens-Brockway Glass Container Inc. Curing coatings on glass containers
US10010327B2 (en) 2010-12-16 2018-07-03 Lawrence Livermore National Security, Llc Expandable implant and implant system
DE112013004003A5 (en) * 2012-08-10 2015-08-06 EvoSense Research & Development GmbH Sensor with simple connection technology
CN103091894B (en) * 2013-01-18 2016-07-06 京东方科技集团股份有限公司 A kind of color membrane substrates and liquid crystal panel
US9315696B2 (en) * 2013-10-31 2016-04-19 Dow Global Technologies Llc Ephemeral bonding
KR101768745B1 (en) * 2014-05-13 2017-08-17 주식회사 엘지화학 Non-curable rubber adhesive composition for touch screen panel and non-curable rubber adhesive film for touch screen panel using the same
US10377922B2 (en) * 2014-06-06 2019-08-13 The Board Of Trustees Of The University Of Illinois Composite dry adhesive and methods of making and using a composite dry adhesive
EP3328457B8 (en) 2015-07-27 2021-06-16 The Texas A&M University System Medical devices coated with shape memory polymer foams
JP6758815B2 (en) * 2015-10-28 2020-09-23 三菱重工業株式会社 Joint evaluation method
CN105552088A (en) * 2016-01-04 2016-05-04 京东方科技集团股份有限公司 Substrate structure and attachment method and stripping method of flexible substrate thereof
WO2018170149A1 (en) 2017-03-14 2018-09-20 Shape Memory Medical, Inc. Shape memory polymer foams to seal space around valves
CN106928881B (en) * 2017-04-27 2019-01-08 湖南师范大学 Reversible adhesive of a kind of starch base based on electroresponse technology and preparation method thereof
CN107068919A (en) * 2017-05-31 2017-08-18 京东方科技集团股份有限公司 The method for manufacturing flexible panel
CN107910458B (en) 2017-11-21 2020-03-10 合肥鑫晟光电科技有限公司 Flexible display substrate, manufacturing method thereof and display panel
WO2019157805A1 (en) * 2018-02-13 2019-08-22 陈志勇 Midsole material and method for manufacturing same, outsole material, hot-melt adhesive film, laminating apparatus and sole
WO2019231875A1 (en) * 2018-05-29 2019-12-05 Henkel IP & Holding GmbH Anaerobic paste compositions
WO2020016627A1 (en) * 2018-07-16 2020-01-23 Bosch Car Multimedia Portugal, S.A. Protective stackable tray for electrostatic discharge sensitive devices using shape memory polymers and a method of manufacturing the tray
EP3815132A4 (en) * 2018-07-30 2022-05-25 Essentium, Inc. High frequency adhesive bonding
CN111040857B (en) * 2019-12-27 2022-09-06 中山大学 Electrorheological fluid and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900387A (en) * 1988-02-24 1990-02-13 The Boeing Company Method of bonding via electrorheological adhesives

Family Cites Families (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4710539A (en) * 1981-11-02 1987-12-01 W. R. Grace & Co. Heat activatable adhesive or sealant compositions
US4863767A (en) * 1984-04-13 1989-09-05 Hoechst Celanese Corporation Method of adhesive bonding by use of thermotropic liquid crystal polymers
GB8706928D0 (en) * 1987-03-24 1987-04-29 Er Fluid Dev Electric field responsive fluids
US4772407A (en) * 1987-12-02 1988-09-20 Lord Corporation Electrorheological fluids
US5190624A (en) * 1988-07-15 1993-03-02 The United States Of America As Represented By The Secretary Of The Navy Electrorheological fluid chemical processing
US5234992A (en) * 1989-02-09 1993-08-10 Alza Corporation Electrotransport adhesive
US5240995A (en) * 1989-02-09 1993-08-31 Alza Corporation Electrotransport adhesive
GB8908825D0 (en) * 1989-04-19 1989-06-07 Block Hermann Electrorheological fluid
US5073282A (en) * 1989-04-21 1991-12-17 Hercules Incorporated Electrorheological fluids
US4992192A (en) * 1989-04-21 1991-02-12 Hercules Incorporated Electrorheological fluids
US4990279A (en) * 1989-04-21 1991-02-05 Hercules Incorporated Electrorheological fluids
US5075021A (en) * 1989-09-29 1991-12-24 Carlson J David Optically transparent electrorheological fluids
JP2799605B2 (en) * 1989-10-25 1998-09-21 株式会社ブリヂストン Electrorheological fluid
US5032308A (en) * 1989-11-07 1991-07-16 The Dow Chemical Company Layered mixed metal hydroxides in electrorheological fluids
US4994198A (en) * 1990-01-29 1991-02-19 Dow Corning Corporation Electrorheological fluids based on silicone ionomer particles
US5252250A (en) * 1990-02-21 1993-10-12 Bridgestone Corporation Electrorheological fluids comprising dielectric particulates dispersed in a highly electrically insulating oily medium
US5071581A (en) * 1990-03-01 1991-12-10 The Dow Chemical Company Electrorheological fluids based on crown ethers and quaternary amines
US5032307A (en) * 1990-04-11 1991-07-16 Lord Corporation Surfactant-based electrorheological materials
US5252249A (en) * 1990-04-26 1993-10-12 Bridgestone Corporation Powder and electrorheological fluid
US5326489A (en) * 1990-07-20 1994-07-05 Nippon Shokubai Co., Ltd. Electrorheological fluids
JPH07108989B2 (en) * 1990-08-02 1995-11-22 株式会社コロイドリサーチ Electrorheological fluid
US5354489A (en) * 1990-08-30 1994-10-11 Asahi Kasei Kogyo Kabushiki Kaisha Method for changing the viscosity of a fluid comprising a liquid crystal compound
US5213713A (en) * 1991-03-21 1993-05-25 The United States Of America As Represented By The Secretary Of The Navy Process of shaping an electrorheological solid
EP0509573B1 (en) * 1991-04-15 1994-05-18 General Motors Corporation Electro-rheological fluids and methods of making and using the same
US5130040A (en) * 1991-05-20 1992-07-14 General Motors Corporation Anhydrous electrorheological compositions including Zr(HPO4)2
US5139692A (en) * 1991-05-20 1992-08-18 General Motors Corporation Electrorheological compositions including an amine-terminated polyester steric stabilizer
US5130039A (en) * 1991-05-20 1992-07-14 General Motors Corporation Anhydrous electrorheological compositions including Liy Si1-x Ax O4
US5139690A (en) * 1991-05-20 1992-08-18 General Motors Corporation Electrorheological compositions including Ax (Lx/2 Sn1-(x/2))O2
US5149454A (en) * 1991-05-20 1992-09-22 General Motors Corporation Electrorheological compositions including am5-11 O8-17
US5130038A (en) * 1991-05-20 1992-07-14 General Motors Corporation Anhydrous electrorheological compositions including A5 MSi4 O.sub.
US5316687A (en) * 1991-05-20 1994-05-31 General Motors Corporation Electrorheological compositions including A1+x Zr2 Six P-x O12
US5139691A (en) * 1991-05-20 1992-08-18 General Motors Corporation Anhydrous electrorheological compositions including Na3 PO4
US5558803A (en) * 1991-08-29 1996-09-24 Nippon Shokubai Co., Ltd. Electrorheological fluid with improved properties comprising composite polymer
US5322634A (en) * 1991-09-16 1994-06-21 Ford Motor Company Electrorheological fluids comprising phenoxy organometallic salt particulate
US5595680A (en) * 1991-10-10 1997-01-21 The Lubrizol Corporation Electrorheological fluids containing polyanilines
JPH06503605A (en) * 1991-10-10 1994-04-21 ザ ルブリゾル コーポレイション Electrorheological fluid containing polyaniline
CA2093315A1 (en) * 1991-10-10 1993-04-11 Charles P. Bryant Electrorheological fluids containing electronically conductive polymers
US5332517A (en) * 1991-12-10 1994-07-26 Kawasaki Steel Corporation Method for producing carbonaceous powder for electrorheological fluid
US5306438A (en) * 1991-12-13 1994-04-26 Lord Corporation Ionic dye-based electrorheological materials
EP0548956B1 (en) * 1991-12-27 1997-04-23 NIPPON OIL Co. Ltd. Electrorheological fluid
US5294360A (en) * 1992-01-31 1994-03-15 Lord Corporation Atomically polarizable electrorheological material
US5445759A (en) * 1992-02-25 1995-08-29 General Motors Corporation Preparation of electrorheological fluids using fullerenes and other crystals having fullerene-like anisotropic electrical properties
JP3511628B2 (en) * 1992-03-23 2004-03-29 藤倉化成株式会社 Electrorheological fluid composition
US5320770A (en) * 1992-04-27 1994-06-14 Dow Corning Corporation Electrorheological (ER) fluid based on amino acid containing metal polyoxo-salts
US5336423A (en) * 1992-05-05 1994-08-09 The Lubrizol Corporation Polymeric salts as dispersed particles in electrorheological fluids
US5702630A (en) * 1992-07-16 1997-12-30 Nippon Oil Company, Ltd. Fluid having both magnetic and electrorheological characteristics
EP0589637B1 (en) * 1992-09-21 1997-06-04 Dow Corning Corporation Improved electrorheological fluid formulations using organosiloxanes
US5894000A (en) * 1992-09-30 1999-04-13 The United States Of America As Represented By The Secratary Of The Navy Electro-rheological fluid composition having polymeric sponge particulates
AU666607B2 (en) * 1993-03-12 1996-02-15 Camp, Inc. Electrorheological fluids with hydrocarbyl aromatic hydroxy compounds
US5536426A (en) * 1993-05-21 1996-07-16 Nippon Oil Company, Ltd. Electrorheological fluid containing carbonaceous particles
JP3413879B2 (en) * 1993-07-15 2003-06-09 藤倉化成株式会社 Electrorheological fluid composition
JPH0790290A (en) * 1993-09-21 1995-04-04 Nippon Oil Co Ltd Dispersing particle having effects of both magnetic and electric viscosity and fluid by using the same
US5435931A (en) * 1993-11-04 1995-07-25 Wisconsin Alumni Research Foundation Protein enhanced electrorheological fluids
US5505871A (en) * 1993-11-23 1996-04-09 General Atomics Electrorheological elastomeric composite materials
JP2526406B2 (en) * 1993-11-30 1996-08-21 工業技術院長 Electrorheological fluid
JPH07150187A (en) * 1993-12-01 1995-06-13 Bridgestone Corp Carbonaceous powder for electroviscous fluid disperse phase and electroviscous fluid
DE69419126T2 (en) * 1993-12-15 1999-11-18 Nippon Catalytic Chem Ind Electroviscous liquid composition
DE69512328T2 (en) * 1994-01-31 2000-01-20 Tonen Corp ELECTROVISCAL FLUID
JPH07226316A (en) * 1994-02-14 1995-08-22 Toyohisa Fujita Magnetic electrorheology fluid and its manufacture
US5429761A (en) * 1994-04-14 1995-07-04 The Lubrizol Corporation Carbonated electrorheological particles
US5445760A (en) * 1994-04-14 1995-08-29 The Lubrizol Corporation Polysaccharide coated electrorheological particles
US5552076A (en) * 1994-06-08 1996-09-03 The Regents Of The University Of Michigan Anhydrous amorphous ceramics as the particulate phase in electrorheological fluids
US5501809A (en) * 1994-08-19 1996-03-26 The Lubrizol Corporation Electrorheological fluids containing particles of a polar solid material and an inactive polymeric material
JPH0867893A (en) * 1994-08-19 1996-03-12 Lubrizol Corp:The Electrorheological fluid of polar solid and an organic semiconductor
US5910269A (en) * 1994-10-20 1999-06-08 Nippon Shokubai Co., Ltd. Electrorheological fluid composition including hydrocarbon compound having at least one unsaturated bond
US5693367A (en) * 1995-03-24 1997-12-02 Bridgestone Corporation Process for producing a powder material for an electro-rheological fluid
US5866249A (en) * 1995-12-18 1999-02-02 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesive based on partially oriented and partially crystallized elastomer
JPH09255982A (en) * 1996-03-26 1997-09-30 Nippon Oil Co Ltd Electroviscous fluid
JP3364117B2 (en) * 1997-08-06 2003-01-08 三菱重工業株式会社 Fine particle dispersion and method for producing the same
JPH11172275A (en) * 1997-12-15 1999-06-29 Bridgestone Corp Electroviscous fluid, its production, and method for its storage
PL342996A1 (en) * 1998-02-23 2001-07-16 Mnemoscience Gmbh Shape memory polymers
US6348679B1 (en) * 1998-03-17 2002-02-19 Ameritherm, Inc. RF active compositions for use in adhesion, bonding and coating
US6352651B1 (en) * 1998-06-08 2002-03-05 Bridgestone Corporation Electrorheological fluid
US6231985B1 (en) * 1999-05-18 2001-05-15 Ashland Inc. Heat and radio frequency-curable two-pack soy protein-based polyurethane adhesive compositions
KR20010019614A (en) * 1999-08-28 2001-03-15 윤덕용 Electrorheological Fluids Dispersed Multi-Phase
US6649888B2 (en) * 1999-09-23 2003-11-18 Codaco, Inc. Radio frequency (RF) heating system
AU1467501A (en) * 1999-11-03 2001-05-14 Nexicor Llc Hand held induction tool
US6347246B1 (en) * 2000-02-03 2002-02-12 Axelgaard Manufacturing Company, Ltd. Electrotransport adhesive for iontophoresis device
KR100333491B1 (en) * 2000-02-17 2002-04-25 최동환 A electro-rheological fluids comprising dried water-soluble starch as a conductive particle
US6514449B1 (en) * 2000-09-22 2003-02-04 Ut-Battelle, Llc Microwave and plasma-assisted modification of composite fiber surface topography
US6602583B2 (en) * 2000-12-14 2003-08-05 World Properties, Inc. Liquid crystalline polymer bond plies and circuits formed therefrom
US6428860B1 (en) * 2001-05-11 2002-08-06 Visteon Global Technologies, Inc. Method for manufacturing magneto-rheological or electro-rheological substance-impregnated materials
US6644196B2 (en) * 2001-11-05 2003-11-11 Heidelberger Druckmaschinen Ag Electrorheological inker

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4900387A (en) * 1988-02-24 1990-02-13 The Boeing Company Method of bonding via electrorheological adhesives

Also Published As

Publication number Publication date
US20050274455A1 (en) 2005-12-15
WO2005123387A2 (en) 2005-12-29

Similar Documents

Publication Publication Date Title
WO2005123387A3 (en) Electro-active adhesive systems
WO2005123388A3 (en) Magneto-active adhesive systems
TW200732450A (en) Adhesive tape for dicing and die bond
ATE496104T1 (en) B CONDITION ADHESIVE FOR CHIP BONDING
WO2008033680A3 (en) Method and apparatus for creating rfid devices using masking techniques
WO2006108054A3 (en) Diffusion delivery system and methods of fabrication
WO2012021196A3 (en) Method for manufacturing electronic devices and electronic devices thereof
WO2009057710A1 (en) Substrate holding member, substrate bonding apparatus, apparatus for manufacturing multilayer substrate, substrate bonding method, method for manufacturing multilayer substrate, and method for manufacturing multilayer semiconductor device
WO2006038030A3 (en) Equipment for wafer bonding
TW200802690A (en) Three dimensional integrated circuit and method of making the same
AU2002243327A1 (en) Hot-melt adhesive for non-woven elastic composite bonding
WO2004023195A3 (en) Electro-optic displays
DE60037331D1 (en) SEPARATE COATING FORMULATION PROVIDING SEPARATE SURFACES WITH LOW ADHESION FOR ADHESIVE ADHESIVES
EP2009660A3 (en) Method of manufacturing panel switch and panel switch
MY145363A (en) Adhesive film and method for manufacturing semiconductor device using same
WO2008108178A1 (en) Microchip manufacturing method
TW200513678A (en) Joined multi functional optical device
TW200507232A (en) Bonding method and bonding device
WO2015107290A3 (en) Process for placing and bonding chips on a receiving substrate using a pad, by means of a magnetic, electrostatic or electromagnetic force
AU2003251401A1 (en) Thermoplastic elastomer bonded directly to metal substrate
WO2005101460A3 (en) Bonding an interconnect to a circuit device and related devices
AU2002245342A1 (en) Method for adhering substrates using light activatable adhesive film
EP1191079B8 (en) Adhesive resin compositions and method for separating adherends bonded together by the compositions
CA2509912A1 (en) Junction substrate and method of bonding substrates together
TW200742738A (en) Glass-molded compound lens and manufacturing method thereof

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Country of ref document: DE

122 Ep: pct application non-entry in european phase