CN106216979A - The detachment device of a kind of semiconductor laser mould bar and shell fragment and method for splitting - Google Patents
The detachment device of a kind of semiconductor laser mould bar and shell fragment and method for splitting Download PDFInfo
- Publication number
- CN106216979A CN106216979A CN201610654664.9A CN201610654664A CN106216979A CN 106216979 A CN106216979 A CN 106216979A CN 201610654664 A CN201610654664 A CN 201610654664A CN 106216979 A CN106216979 A CN 106216979A
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- China
- Prior art keywords
- mould bar
- shell fragment
- semiconductor laser
- track
- detachment device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
Abstract
The present invention relates to a kind of semiconductor laser mould bar and the detachment device of shell fragment and method for splitting, belong to LD encapsulation technology field, device includes frock pallet, frock tray bottom is provided with mould bar track, mould bar track entry end is arranged with tears sheet projection open, tear the protruding phase spacing of sheet open and be less than shell fragment length, mould bar is pushed mould bar track, by shell fragment gear to separating with mould bar under tearing the convex role of sheet open.The present invention solves the work drawback manually tearing sheet open, improves production efficiency, it is ensured that the safety of operation on the premise of ensureing product quality.
Description
Technical field
The present invention relates to a kind of semiconductor laser mould bar and the detachment device of shell fragment and method for splitting, belong to LD encapsulation
Technical field.
Background technology
Through the development of decades, semiconductor laser is increasingly by known to society, and obtains in field, many places
To application, the photoelectric transformation efficiency of semiconductor laser, more than 60%, is significantly larger than the opto-electronic conversion effect of other like products
Rate, the advantages such as its energy consumption is low, and in device, heat accumulation is few, life-span length, collimation are good, illumination distances is remote are made in social similar industry
More and more extensive for a kind of emerging technology application.All kinds of advantages that semiconductor laser is had determine that it more and more higher is subject to
The extensive attention of various circles of society.
Semiconductor laser needs the packing forms through multiple operations in process of production, but semiconductor laser is originally
Body contour feature and operating characteristic thereof determine that it can not be isolated in encapsulation process, owing to the operating characteristic of semiconductor laser is determined
Fixed its has certain delicate nature, so semiconductor laser needs special carrier to realize whole encapsulation in process of production
Process, thus adapt to different packaging process.
There is encapsulation production form miscellaneous in the production industry at whole semiconductor laser, different encapsulation produces
Form needs to use different carriers and produces to the encapsulation realizing semiconductor laser.Described in the inventive method is exactly half-and-half to lead
Body laser produces the fractionation with carrier mould bar with shell fragment, and this carrier mould bar of using carries out what semiconductor laser encapsulation produced
Most in whole industry of form.
First having to be fixed on carrier mould bar in the production encapsulation process of semiconductor laser, mould bar was producing
Journey plays the effect of fixing protection semiconductor laser.Semiconductor laser can overall be packaged as on carrier mould bar
Produce the shell fragment also needing to match with mould bar and be fixed in mould bar, so in producing encapsulation process guarantee its will not
Come off from carrier mould bar.
There is multiple operation owing to whole semiconductor laser produces encapsulation process, different operations have different encapsulation shapes
Formula, wherein the packing forms of bonding wire operation needs to pull down shell fragment from mould bar, namely shell fragment and the fractionation of mould bar.At present,
The mode tearing sheet (mould bar and the fractionation of shell fragment) in the industry open is manual work, and workman is also " fighting separately ", not
A kind of perfect sheet method of tearing open, and free-hand sheet production efficiency of tearing open is the lowest, easily pollutes product, because shell fragment used
For iron plate the most processed, during tearing sheet open, there is certain danger coefficient, if imprudence can scratch the hands of workman.There is no perfect tearing open
Sheet method has had a strong impact on the encapsulation of whole semiconductor laser and has produced the work efficiency of line.
Chinese patent CN202622300U discloses a kind of mould bar method for dismounting, and the method uses a kind of mould bar puller,
Including cylinder, pusher, fixture and plunger tip, pushing means is installed between cylinder and fixture, and pusher is close to fixture
One end be fixed with plunger tip, plunger tip is corresponding with the recessed position of the mould bar being placed on fixture.Simple in construction, it is simple to operation,
On the premise of reducing human resources, improve labor productivity, also improve the safety of production simultaneously.But this tear sheet open
Method is the most loaded down with trivial details, and pusher is connected by cylinder, does not ensures that and tears sheet open at the uniform velocity, it is possible to cause tearing sheet mistake open
Base on the random mould bar in the excessive top of thrust in journey.And this mould bar pusher used is manufactured excessively complicated, is processed into
This is too high, is unfavorable for batch production.
Summary of the invention
Splitting, with shell fragment, the problem that technology exists for existing semiconductor laser mould bar, the present invention provides one to tear sheet open
Efficiency is high, and what safety coefficient was high tears sheet devices open and utilize the method for splitting of this device.
Technical scheme is as follows:
A kind of semiconductor laser mould bar and the detachment device of shell fragment, including frock pallet, frock tray bottom is provided with
Mould bar track, mould bar track entry end is arranged with tears sheet projection open, tears the protruding phase spacing of sheet open less than shell fragment length.
According to currently preferred, described frock pallet is the frock pallet that rustless steel is made.The frock of stainless steel
Pallet is wear-resisting, it is ensured that be unlikely to during tearing sheet for a long time open owing to abrasion causes the mould bar track of frock pallet to go out
Existing deviation.
According to currently preferred, mould bar track entry end is provided with domatic.Arrange angled domatic, the bullet pulled down can be made
Sheet skids off pallet along inclined-plane, it is to avoid the next fractionation action of impact, makes fractionation to be carried out continuously.
According to currently preferred, it is protruding that mould bar track terminal is provided with at least one terminal.
It is further preferred that mould bar track terminal is arranged with two terminal projections, the horizontal plane of terminal projection is higher than mould
Bar track horizontal plane.Terminal projection mould bar after stopping fractionation skids off frock pallet.
It is further preferred that the height of terminal projection is identical with mould bar height.Can significantly more efficient stop mould bar.
It is further preferred that the length of the width of mould bar track and mould bar matches, a length of at least the two of mould bar track
The width of individual mould bar and.Frock pallet so can be made to have certain memory length, make the frock pallet can be with Coutinuous store
Mould bar after multiple fractionations, when storing the mould bar after having multiple fractionation side by side on mould bar track, can be overall by this frock pallet
Move to subsequent processing, improve work efficiency further.
According to currently preferred, two outer side edges that mould bar track is relative are provided with rail walls.Rail walls can make mould bar edge
Mould bar track moves, it is to avoid mould bar in mould bar track, there is transverse shifting and cause put in disorder, rock the problems such as base.
According to currently preferred, mould bar track bottom surface is run through and is provided with through hole.To alleviate the weight of frock pallet.
A kind of method for splitting utilizing above-mentioned semiconductor laser mould bar and the detachment device of shell fragment, including step such as
Under:
(1) the mould bar snapped together with shell fragment is put the arrival end to the mould bar track being located at frock tray bottom；
(2) mould bar track entry end is arranged with and tears sheet projection open, tears the protruding phase spacing of sheet open and is less than shell fragment length, by mould
Bar pushes mould bar track, by shell fragment gear to separating with mould bar under tearing the convex role of sheet open；
(3) mould bar track entry end is provided with domatic, and shell fragment is along domatic landing, and mould bar pushes in mould bar track.
According to currently preferred, also include step (4), repeat step (1)～(3) at least twice, make frock pallet
Mould bar after storage at least two splits in mould bar track.
The present invention solves the work drawback manually tearing sheet open, improves production efficiency on the premise of ensureing product quality,
Ensure that the safety of operation.Compared with prior art, beneficial effects of the present invention is as follows:
1, utilize technical scheme can substantially increase speed of production, save the time, improve inter process
Fluency.
2, technical scheme makes the fractionation mechanization of mould bar shell fragment, it is to avoid the dirt that product is caused by manual demolition
Dye, also reduces the manual danger coefficient tearing sheet open, beneficially staff's life and health simultaneously.
3, utilize technical scheme can significantly reduce the quantity tearing sheet personnel open, save manpower, decrease
Artificial amount, accomplishes the effect got twice the result with half the effort.
4, the frock pallet volume that the present invention uses is little, simple in construction, and processing is simple, and manufacture process is convenient, cost of manufacture
Cheap, be conducive to popularizing.
5, technical scheme prepares the most at the uniform velocity, compared to manually tearing the sudden of sheet open the promotion of mould bar is controlled
And unstability, tear sheet projection open and shell fragment is stopped that the fixation of principle and mould bar track both sides rail walls all makes to push away
Dynamic, split process is very steady, greatly reduce and base in operation rocked and damages, improve yield rate.
Accompanying drawing explanation
Fig. 1 is the structural representation of detachment device of the present invention；
Fig. 2 is that the present invention needs to tear open the semiconductor laser mould bar of sheet and the assembly of shell fragment；
In Fig. 1,1, to tear sheet open protruding, 2, mould bar track, 3, terminal protruding, 4, domatic, 5, rail walls.
Detailed description of the invention
Below in conjunction with embodiment and Figure of description, the present invention is described in detail, but is not limited to this.
As shown in Figure 1-2.
Embodiment 1
A kind of semiconductor laser mould bar and the detachment device of shell fragment, including frock pallet, frock tray bottom is provided with
Mould bar track, mould bar track entry end is arranged with tears sheet projection open, tears the protruding phase spacing of sheet open and is less than shell fragment length, such
Shell fragment can be kept off down completely while being designed to ensure to promote forward mould bar, it is achieved tear the purpose of sheet open.Frock pallet is not
The frock pallet that rust steel is made, the frock pallet of stainless steel is wear-resisting, it is ensured that during tearing sheet for a long time open not
Cause the mould bar track of frock pallet that deviation occurs as due to abrasion.
Embodiment 2
A kind of semiconductor laser mould bar and the detachment device of shell fragment, as described in Example 1, difference is its structure,
Mould bar track entry end is provided with domatic.Arrange angled domatic, the shell fragment pulled down can be made to skid off pallet along inclined-plane, it is to avoid tear open
Under shell fragment save bit by bit in frock pallet impact and tear the work efficiency of sheet open, had this domatic, it is ensured that shell fragment is from mould bar
Frock pallet can be skidded off along domatic, it is ensured that the fluency of work after pulling down.
Embodiment 3
A kind of semiconductor laser mould bar and the detachment device of shell fragment, as described in Example 1, difference is its structure,
Mould bar track terminal is arranged with two terminal projections, and the horizontal plane of terminal projection is higher than mould bar track horizontal plane.Terminal is protruding
Mould bar after stopping fractionation skids off frock pallet from the terminal of mould bar track.
Embodiment 4
A kind of semiconductor laser mould bar and the detachment device of shell fragment, as described in Example 3, difference is its structure,
The height of terminal projection is identical with mould bar height.Can significantly more efficient stop mould bar.
Embodiment 5
A kind of semiconductor laser mould bar and the detachment device of shell fragment, as described in Example 2, difference is its structure,
The width of mould bar track matches with the length of mould bar, the width of a length of four mould bars of mould bar track and.So can make work
Dress pallet has certain memory length, and the mould bar after making a frock pallet can split with Coutinuous store four, when mould bar rail
When storing the mould bar after having four to split side by side on road, this frock pallet entirety can be moved to subsequent processing, improve work further
Make efficiency.Also different mould bar track lengths can be set according to needs of production with reference to the present embodiment.The width of mould bar track
And surface smoothness is suitable for the slip of mould bar, in the case of need not too arduously, it is achieved the level of mould bar is slided.
Embodiment 6
A kind of semiconductor laser mould bar and the detachment device of shell fragment, as described in Example 1, difference is its structure,
Two outer side edges that mould bar track is relative are provided with rail walls.Rail walls can make mould bar move along mould bar track, it is to avoid mould bar is at mould
Occur in bar track transverse shifting and causing put in disorder, rock the problems such as base.
Embodiment 7
A kind of semiconductor laser mould bar and the detachment device of shell fragment, as described in Example 1, difference is its structure,
Mould bar track bottom surface is run through and is provided with three strip through holes, two short strip shape through holes and four manholes, as it is shown in figure 1,
The weight of frock pallet is alleviated on the premise of maintaining frock pallet works intensity.
Embodiment 8
A kind of method for splitting utilizing semiconductor laser mould bar described in embodiment 5 and the detachment device of shell fragment, including
Step is as follows:
(1) product descended from top operation is the mould bar snapped together with shell fragment, and mould bar is mounted with base,
What on mould bar now, base leaned on is that shell fragment is fixed, and puts the mould bar snapped together with shell fragment to being located at frock tray bottom
The arrival end of mould bar track；
(2) mould bar track entry end is arranged with and tears sheet projection open, tears the protruding phase spacing of sheet open and is less than shell fragment length, by mould
Bar pushes in mould bar track along mould bar track, along with the movement forward of mould bar, is kept off extremely by shell fragment under tearing the convex role of sheet open
Separate with mould bar；
(3) mould bar track entry end is provided with domatic, and shell fragment is along domatic landing, and mould bar pushes in mould bar track, thus realizes
Whole tear sheet open.
Embodiment 9
A kind of method for splitting utilizing semiconductor laser mould bar described in embodiment 5 and the detachment device of shell fragment, step
The same as in Example 8, difference is, also includes step (4), repetition step (1)～(3) four times, makes the mould bar rail of frock pallet
The mould bar after four fractionations is stored in road.
Claims (10)
1. a semiconductor laser detachment device for mould bar Yu shell fragment, including frock pallet, it is characterised in that frock pallet
Bottom is provided with mould bar track, and mould bar track entry end is arranged with tears sheet projection open, tears the protruding phase spacing of sheet open long less than shell fragment
Degree.
Semiconductor laser mould bar the most according to claim 1 and the detachment device of shell fragment, it is characterised in that described work
Dress pallet is the frock pallet that rustless steel is made.
Semiconductor laser mould bar the most according to claim 1 and the detachment device of shell fragment, it is characterised in that mould bar rail
Road arrival end is provided with domatic.
Semiconductor laser mould bar the most according to claim 1 and the detachment device of shell fragment, it is characterised in that mould bar rail
It is protruding that road terminal is provided with at least one terminal.
Semiconductor laser mould bar the most according to claim 4 and the detachment device of shell fragment, it is characterised in that mould bar rail
Road terminal is arranged with two terminal projections, and the horizontal plane of terminal projection is higher than mould bar track horizontal plane.
Semiconductor laser mould bar the most according to claim 5 and the detachment device of shell fragment, it is characterised in that terminal is convex
The height risen is identical with mould bar height.
Semiconductor laser mould bar the most according to claim 3 and the detachment device of shell fragment, it is characterised in that mould bar rail
The width in road matches with the length of mould bar, the width of a length of at least two mould bar of mould bar track and.
Semiconductor laser mould bar the most according to claim 1 and the detachment device of shell fragment, it is characterised in that mould bar rail
Two outer side edges that road is relative are provided with rail walls, it is preferred that mould bar track bottom surface is run through and is provided with through hole.
9. utilize a method for splitting for the semiconductor laser mould bar described in claim 7 and the detachment device of shell fragment, its
It is characterised by, comprises the following steps that
(1) the mould bar snapped together with shell fragment is put the arrival end to the mould bar track being located at frock tray bottom；
(2) mould bar track entry end is arranged with and tears sheet projection open, tears the protruding phase spacing of sheet open and is less than shell fragment length, is pushed away by mould bar
Enter mould bar track, by shell fragment gear to separating with mould bar under tearing the convex role of sheet open；
(3) mould bar track entry end is provided with domatic, and shell fragment is along domatic landing, and mould bar pushes in mould bar track.
Method for splitting the most according to claim 9, it is characterised in that also include step (4), repeats step (1)～(3)
At least twice, the mould bar after at least two splits is stored in making the mould bar track of frock pallet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610654664.9A CN106216979B (en) | 2016-08-10 | 2016-08-10 | A kind of detachment device and method for splitting of semiconductor laser mould item and shrapnel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610654664.9A CN106216979B (en) | 2016-08-10 | 2016-08-10 | A kind of detachment device and method for splitting of semiconductor laser mould item and shrapnel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106216979A true CN106216979A (en) | 2016-12-14 |
| CN106216979B CN106216979B (en) | 2018-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610654664.9A Active CN106216979B (en) | 2016-08-10 | 2016-08-10 | A kind of detachment device and method for splitting of semiconductor laser mould item and shrapnel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109872956A (en) * | 2017-12-05 | 2019-06-11 | 山东华光光电子股份有限公司 | A kind of the rapid material-feeding device and its charging method of semiconductor laser tube socket |
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| CN201792182U (en) * | 2010-09-21 | 2011-04-13 | 深圳市源磊科技有限公司 | Light emitting diode (LED) module strip disassembling machine |
| CN205265034U (en) * | 2015-12-30 | 2016-05-25 | 山东华光光电子有限公司 | Semiconductor laser tube socket fixed mould strip |
| CN205914987U (en) * | 2016-08-10 | 2017-02-01 | 山东华光光电子股份有限公司 | Splitting device of mould strip and shell fragment for semiconductor laser |
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2016
- 2016-08-10 CN CN201610654664.9A patent/CN106216979B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090208307A1 (en) * | 2008-02-18 | 2009-08-20 | Guyton Jason D | Releasable Fastener Systems and Methods |
| CN201693343U (en) * | 2010-01-25 | 2011-01-05 | 鸿富锦精密工业（深圳）有限公司 | Disassembling device |
| CN201792182U (en) * | 2010-09-21 | 2011-04-13 | 深圳市源磊科技有限公司 | Light emitting diode (LED) module strip disassembling machine |
| CN205265034U (en) * | 2015-12-30 | 2016-05-25 | 山东华光光电子有限公司 | Semiconductor laser tube socket fixed mould strip |
| CN205914987U (en) * | 2016-08-10 | 2017-02-01 | 山东华光光电子股份有限公司 | Splitting device of mould strip and shell fragment for semiconductor laser |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109872956A (en) * | 2017-12-05 | 2019-06-11 | 山东华光光电子股份有限公司 | A kind of the rapid material-feeding device and its charging method of semiconductor laser tube socket |
| CN109872956B (en) * | 2017-12-05 | 2020-11-27 | 山东华光光电子股份有限公司 | Rapid feeding device and method for tube seat for semiconductor laser |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106216979B (en) | 2018-08-28 |
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