CN101660882A - Manufacturing method and structure of radiating fins - Google Patents
Manufacturing method and structure of radiating fins Download PDFInfo
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- CN101660882A CN101660882A CN200810135534A CN200810135534A CN101660882A CN 101660882 A CN101660882 A CN 101660882A CN 200810135534 A CN200810135534 A CN 200810135534A CN 200810135534 A CN200810135534 A CN 200810135534A CN 101660882 A CN101660882 A CN 101660882A
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Abstract
The invention relates to a manufacturing method of radiating fins, which comprises the following steps: 1, preparing powder of a far infrared ray material; 2, carrying out surface modification of thepowder; and 3, coating the powder on the surface of a substrate by thermal spraying to form a heat-dissipating layer on the surface of the substrate. Therefore, the far infrared ray material is coatedon the surface of the substrate directly by a thermal spraying process, heat dissipation is implemented by the thermal radiation effect of the far infrared ray material and equivalent thermal resistance between the substrate and air is reduced so as to form a structure of the radiating fin with high radiation rate. The invention further provides the structure of the radiating fins.
Description
Technical field
The present invention refers to a kind of manufacture method and structure thereof that has the fin of thermal radiation function on the substrate with formation that the far infrared powder is coated in especially relevant for a kind of manufacture method and structure thereof of fin.
Background technology
Cool electronic assemblies or heat that its running is produced remove a big obstacle that is always the electronic industry development, in order to solve heat dissipation problem, the fin of various different purposes and form is also developed thereupon.In response to the raising and the multi-functional application of dynamical requirement, degree of integration, also face big challenge for the requirement of dispelling the heat.So just become the major subjects of electronics industry for the research and development of heat transfer efficient.
Fin generally is used in heat dissipation with assembly or system among atmosphere; And can have higher radiating efficiency with lower this fin of condition stub of thermal resistance usually.In general, thermal resistance is made of the diffusion thermal resistance of fin inside and the thermal-convection resistance between this fin surface and the atmospheric environment; On using, the material of high conductance such as copper, aluminium etc. often are used to make fin to reduce the diffusion thermal resistance; Yet thermal-convection resistance has limited the usefulness of fin, makes it can't reach the heat radiation requirement of electronic building brick of new generation.In view of the above, existing market all is conceived to more efficient cooling mechanism.
Be to utilize the mode of die cast, crowded type, forging or machining that homogenous material is made into heat radiating fin structure traditionally.On external form, must improve the effect of the surface area of fin in order to heat radiation, and the space between the structure can be introduced cross-ventilation and be improved radiating efficiency, so the normal utilization of heat radiating fin structure uprightly is arranged at the fin structure on the pedestal, this structure can significantly improve the surface area of fin, more can utilize the air between the adjacent fin to carry out thermal convection current.On the other hand, materials such as normal aluminium of fin or copper are derived heat outside system efficiently with the heat exchange pattern of high conductance.
And under the thinking that composite is used, the normal operating efficiency of using the combination of multiple material with the raising fin, for example copper, aluminum are engaged the fin of reaching efficient height and light weight with the low-density characteristic of the high conductance of using copper simultaneously and aluminium, yet said method but must solve the problem of the interface thermal resistance between the different materials.
In addition, it is to utilize organic binder to cohere far-infrared ray material on metal fin that known radiator structure is also arranged, but because the thermal resistance of organic binder itself is big, causes the thermal resistance of hot biography approach to increase, so radiating effect does not have tangible increase.
Edge is, the improving of the above-mentioned disappearance of inventor's thoughts proposes a kind of reasonable in design and effectively improve the present invention of above-mentioned disappearance.
Summary of the invention
Main purpose of the present invention, being to provide a kind of manufacture method of fin, this method is to use a thermal spraying processing procedure far infrared powder is coated in the surface of substrate, to form a heat dissipating layer.
In order to reach above-mentioned purpose, the invention provides a kind of manufacture method of fin, its step is as follows: step 1: the powder for preparing a far-infrared ray material; Step 2: this powder is carried out surfaction; And step 3: with this powder of thermal spraying mode coating in the surface of a substrate, on this substrate surface, to form a heat dissipating layer.
The present invention also provides a kind of structure according to the prepared fin of above-mentioned manufacture method, it comprises: a substrate and is coated in the heat dissipating layer on this substrate, this heat radiating fin structure is in order to be arranged on the thermal source, this substrate is used for the heat that this thermal source produces is conducted to this heat dissipating layer, and this heat dissipating layer is used for and will be converted into far infrared by the heat that this substrate conducted and to external radiation.
The present invention has following useful effect: the manufacture method that the present invention proposes, the powder that uses the thermal spraying mode will have far infrared function is coated on the substrate, to form a thin and uniform heat dissipating layer, so the heat that the radiator structure of this manufacture made can utilize above-mentioned heat dissipating layer that electronic building brick etc. is produced outwards looses in the mode of far-infrared radiation and overflows, so that a preferable radiating effect to be provided.
For enabling further to understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the flow chart of the manufacture method of fin of the present invention.
Fig. 2 is the schematic diagram of fin of the present invention.
Fig. 3 for fin of the present invention be applied to a thermal source and with heat to extraradial schematic diagram.
The primary clustering symbol description
1 fin
11 substrates, 12 heat dissipating layers
2 thermals source
The H predetermined thickness
The specific embodiment
See also Fig. 1 and Fig. 2, the invention provides a kind of manufacture method of fin, this manufacture method can form a heat dissipating layer 12 in conjunction with (or claiming to drape over one's shoulders plating) in the surface of a substrate 11 with the direct coating of far-infrared ray material, and this substrate 11 and 12 of this heat dissipating layers are construed as the fin 1 of a high cooling efficiency, and its manufacture method comprises the steps:
Step (one):, and prepare the powder unit of above-mentioned far-infrared ray material based on far-infrared ray material.In general, far-infrared ray material often is selected from ore, and the chemical composition complexity is wayward, and major part contains radioactivity rare earth element or heavy metal, but the far infrared of rare earth element stimulus material discharges; Tool far infrared function inorganic matter is a lot, the powder color not necessarily, remove tourmaline, volcanic rock or with Meng Zongzhu, coconut husk through high temperature more than 1000 ℃ Celsius, also have a far infrared function.So must carry out correlation analysis and experiment at far-infrared ray material earlier among the present invention, for example, the present invention carries out constituent analysis with regard to various far-infrared ray materials earlier and crystalline phase is observed, and by above-mentioned analysis result, the powder of preparation far-infrared ray material, and this powder has a predetermined infrared emission rate, and this predetermined infrared emission rate can be equal to the infrared emission rate of selected far-infrared ray material.In this specific embodiment, this powder is made by the ceramic material with far infrared irradiation ability, for example this ceramic material is that clay mixes, it is by the clay of percentage by weight 10 to 15, the phyllite of percentage by weight 10 to 20, the tourmaline of percentage by weight 40 to 50, the potassic feldspar of percentage by weight 5 to 10, the albite of percentage by weight 5 to 10, the schreyerite stone of percentage by weight 5 to 10, the cupric oxide of percentage by weight 5 to 10 and the DK2001 organic matter of percentage by weight 10 are formed, through pulverizing, sieve, mix, stir, granulation, oven dry, sintering, pulverize, mediation forms, but above-mentioned proportion of composing only is usefulness for example, is not in order to restriction the present invention.The formed powder of above-mentioned constituent can and be incorporated on the surface of this substrate 11 in order to coating; These substrate 11 the bests are the made plate workpiece of a metal material, and it has good conductibility to heat, can be effectively with thermal conductance for outside the system.
Step (two): the step of this powder being carried out surfaction.This step claims surface treatment or Surface Machining again, and its purpose is further to adjust the physics or the chemical characteristic of this powder surface.Owing to the invention reside in the above-mentioned powder coating with far infrared irradiation ability is taken shape on this substrate 11, so must carry out the operation of surfaction at those powders, with the parameter of the particle diameter of adjusting this powder, outward appearance so that its more easily be coated in this substrate 11 and have preferable adhesion; On the other hand,, can adjust the crystalline phase of this powder simultaneously, for example utilize a heat treatment process, the powder crystalline phase be formed be beneficial to successive process most, or make this heat dissipating layer 12 have the effect of higher radiating efficiency by this upgrading step.Moreover, this surfaction step more can comprise a coating processing procedure, with surperficial coating one shell (figure does not show) at this powder, this shell can provide the preferable flow behavior of this powder (also claiming lubricity), and then the carrying out of improving follow-up coating step, for instance, can utilize plating, electroless plating or change into the lower shells of mode coating one fusing point such as processing, this low-melting shell can be in following coating process is fusing earlier than this powder, and form the space of fluid filling between powder, and, can strengthen the characteristic of this heat dissipating layer 12 by the increase of this powder fluidity.
Step (three): this powder of coating is in the surface of a substrate 11, to form a heat dissipating layer 12 on these substrate 11 surfaces.The present invention utilizes the technology of thermal spraying (thermal spray also claims hot melt spray or hot melt to penetrate) that those powders are coated on this substrate 11, and on this substrate 11 moulding one heat dissipating layer 12.This thermal spraying processing procedure carries out powder and is coated on this substrate 11, can make coating layer have a homogeneous thickness, and the infrared emission rate that this coating layer (heat dissipating layer 12) is possessed is same as the predetermined infrared emission rate of being somebody's turn to do of this powder; In addition, utilize above-mentioned thermal spraying processing procedure can make between this heat dissipating layer 12 and the substrate 11 and have good tack, make better heat-radiation effect.
Plasma spray technology is the heating by heating source, after desiring the material heating and melting of coating, and this covering material can be wire rod, bar or form of powder, and the thrust by gas is sprayed into the technology that work piece surface forms coating layer with fusion or semi-molten material again.In an embodiment of the present invention, can utilize flame combustion, as flame meltallizing (Flame spray), high-speed flame meltallizing (Highvelocity oxy-fuel, the mode that provides of mode or electric energy such as HVOF), as electricity slurry meltallizing (Plasmaspray), electric arc meltallizing processing procedures such as (Arc spray), the powder of the far-infrared ray material of step 1 is heated to fusion or semi-molten state, again with high pressure draught atomizing and carry above-mentioned molten state or semi-molten particle in the surface of this substrate 11, the far infrared powder of molten state or semi-molten particle clashes into this substrate 11 surfaces via high pressure draught, to form flat particle, those flat far infrared particles form the heat dissipating layer 12 of a thermal spraying moulding more then through in layer storehouse via cooling step.It should be noted that, though far-infrared ray material can absorb the far infrared of thermal power transfer Cheng Gengyi radiation, reach the effect of strengthening heat radiation with radiation mode, but the thermal conductivity ratio metal substrate 11 of this heat dissipating layer 12 is low, make the thickness of this substrate 11 must be within the specific limits, thickness is blocked up to cause the heat conduction of solid-state structure (being integral heat sink sheet 1) to reduce, though increase the radiation of heat effect, whole heat-sinking capability may not promote to some extent.Far infrared is in the nature light, as long as the very thin one deck of coating can obtain radiation effect, therefore the far infrared coating thinning as far as possible on the radiating fin, but the mechanism of the radiation effects of far-infrared ray material comes from crystalline texture, too thin coating rete is difficult to obtain good crystalline texture, cause the far infrared irradiation rate to reduce, so the heat dissipating layer 12 of far-infrared ray material also have a lower thickness.In the present embodiment, this heat dissipating layer 12 has a uniform predetermined thickness H, and this predetermined thickness H is less than 100 μ m, cause the reduction of heat conduction efficiency to avoid too thick coating layer, and under this thickness condition, crystalline texture can reach good far-infrared radiation effect.
And before this thermal spraying step, comprising a pre-treatment program best, the step of a cleaning action and a surface coarsening is carried out on its surface that is primarily aimed at this substrate 11.This pre-treatment processing procedure can clean the surface of this substrate 11 and improve the surface of substrate 11 and the contact area of the far infrared powder of this molten state or semi-molten particle, and then improves the Construction of Thermal Spraying quality of this heat dissipating layer 12.This cleaning is to remove moisture, oxide-film or other grease, the dirt etc. on these substrate 11 surfaces, utilize greasy dirt, the grease of the non-dissolubility of grease removal removal of solvents, and some dirts that stick or chip etc., and remove cleaning function that fatsolvent produced can remove above-mentioned impurity and significantly improve the coating film with by the adhesion of coating workpiece; In addition, in order to reach this coating film and by the physical bond between the coating workpiece, must improve the rugosity on these substrate 11 surfaces, that is the surface area on raising substrate 11 surfaces and surface is irregularly shaped, the far infrared powder that makes this above-mentioned molten state or semi-molten particle is along with airflow strikes during to these substrate 11 surfaces, can obtain preferable interlock by the surface (rough surface characteristics) of higher rugosity, improve the bond strength of these substrate 11 surfaces and this heat dissipating layer 12 simultaneously.
Moreover the condition of this thermal spraying processing procedure is mainly pressure and temperature, and can adjust the parameter of thermal spraying processing procedure according to the far infrared powder of different melt temperatures, for example changes different this powders of powder feeding angle adjustment and enters the zone of different flame temperatures; Also or adjust the electric current or the combination of gas, as the flow proportional of helium, argon gas, with the powder that the different melting points characteristic is provided preferable fusion effect and thermal spraying effect.
And after above-mentioned step, this substrate 11 and 12 of this heat dissipating layers are construed as the fin 1 of a high cooling efficiency, can test at the heat sinking function of this fin 1, for example, carry out a functional test with the traditional heat-dissipating fin at this fin 1 one fixedly under the condition of thermal source; Also can reach with the bond strength of this substrate 11 on the other hand and do a comprehensive test, with function and the application of guaranteeing this fin 1 at crystalline phase, thickness, the far infrared irradiation rate of this heat dissipating layer 12.
On the other hand, manufacture method of the present invention also can be applicable to a continuous thermal spraying processing procedure, the above-mentioned powder with far infrared irradiation is coated in continuously the fin 1 that has the heat dissipating layer 12 of far infrared function on this substrate 11 with formation.Because the processing procedure of thermal spraying can import the cooling air, so process temperatures can effectively reduce, the Construction of Thermal Spraying mode is less for the restriction of surface of the work size shape simultaneously, and the rete stackeding speed of thermal spraying is fast, the thickness of heat dissipating layer 12 is even, so be fit to very much carry out successional thermal spraying operation in the mode of automation.
The present invention is after above-mentioned steps, then can obtain a fin 1, this fin 1 comprises: a substrate 11 and is coated in the heat dissipating layer 12 on these substrate 11 surfaces by the thermal spraying processing procedure, this heat dissipating layer 12 is formed by the powder with far infrared irradiation, and this heat dissipating layer 12 has far infrared radiation function equally.Please refer to Fig. 3, so when this fin 1 is applied to the heat dissipation of a heat-generating units (thermal source 2 as shown in Figure 3), this heat-generating units outwards removes by this good substrate 11 of conductibility as the heat of an electronic building brick, and this heat dissipating layer 12 is a kind of carrier of power conversion, the electron transition that the crystal structure of the heat that is conducted by this substrate 11 by these heat dissipating layer 12 formed tool far infrared radiation functions forms, thereby be converted to a kind of form of energy of radiative property: the far infrared electromagnetic radiation is with outside scattering (shown in the arrow among Fig. 3), its emission wavelength is 2～18 μ m, and its emissivity reaches 93%; That is this heat dissipating layer 12 can become thermal power transfer the electromagnetic radiation that is not absorbed by metal material to loose to excessive with the form of light quantum, reach the effect of quick heat radiating, and then improve cooling-down effect to electronic building brick or other heat-generating units and then the life-span of improving assembly.
In sum, the present invention has following all advantage:
1, have preferable thermolysis, because far-infrared ray material is converted to far infrared with infrared ray, the radiation-curable distance more farther than infrared ray of the long wavelength of far infrared has the function that helps heat energy radiation in the space.High efficiency far-infrared ray material absorbs infrared ray, converts the far infrared of easier radiation to, reaches the effect of heat dissipation.So fin 1 of the present invention is promptly used the function that above-mentioned far-infrared ray material has outside emittance, heat is imported this by substrate 11 have the heat dissipating layer 12 of far infrared radiation function, cooperate the metal substrate 11 of high conductance that heat is overflow, derives by pyrotoxin is outwards diffusing with efficient radiation mode.
2, on the other hand, this method utilizes the thermal spraying processing procedure far infrared powder to be coated in the surface of this substrate 11 to form above-mentioned heat dissipating layer 12, use the thermal spraying processing procedure can obtain thin and uniform coating layer structure, and then make the integral heat sink effect have more uniformity.The direct welding far-infrared ray material of the present invention is in these substrate 11 surfaces, above-mentioned thermal spraying mode is the processing procedure mode of a formation thermal resistance minimum, add the control of thickness and crystallization degree, can obtain obviously to improve the effect of heat radiation, that is use the thermal spraying processing procedure far-infrared ray material directly to be coated in the surface of substrate 11, power conversion function with far-infrared ray material improves thermoradiation efficiency, reduces the equivalent thermal resistance between substrate 11 and air, forms the heat radiating fin structure of high rate of heat dissipation.
But the above only is preferred embodiment of the present invention, non-ly is intended to limit to scope of patent protection of the present invention, so the equivalence of using specification of the present invention and graphic content to do such as changes, all in like manner all is contained in the scope of the present invention, closes and gives Chen Ming.
Claims (10)
1, a kind of manufacture method of fin is characterized in that, comprises the following steps:
Step 1: the powder for preparing a far-infrared ray material;
Step 2: this powder is carried out surfaction; And
Step 3: with this powder of thermal spraying mode coating in the surface of a substrate, on this substrate surface, to form a heat dissipating layer.
2, the manufacture method of fin as claimed in claim 1 is characterized in that: in step 1, this powder has a predetermined infrared emission rate.
3, the manufacture method of fin as claimed in claim 2 is characterized in that: this powder is made by the ceramic material with far infrared irradiation ability.
4, the manufacture method of fin as claimed in claim 3 is characterized in that: this ceramic material comprises clay, phyllite and tourmaline.
5, the manufacture method of fin as claimed in claim 4 is characterized in that: this ceramic material further comprises potassic feldspar, albite, schreyerite stone and cupric oxide.
6, the manufacture method of fin as claimed in claim 3 is characterized in that: step 2 is to adjust particle diameter, crystalline phase or the outward appearance of this powder, and improves the flowability of this powder.
7, the manufacture method of fin as claimed in claim 6 is characterized in that: be the surface that directly this powder is incorporated into this substrate in the thermal spraying mode in step 3.
8, the manufacture method of fin as claimed in claim 7 is characterized in that: the infrared emission rate of this heat dissipating layer is same as the predetermined infrared emission rate of being somebody's turn to do of this powder.
9, the manufacture method of fin as claimed in claim 8 is characterized in that: this heat dissipating layer has a predetermined thickness, and this predetermined thickness is less than 100 μ m.
10, a kind of heat radiating fin structure of manufacture method manufacturing of fin as claimed in claim 1 is characterized in that, comprising:
One substrate and one is coated in the heat dissipating layer on this substrate, this heat radiating fin structure is in order to be arranged on the thermal source, this substrate is used for the heat that this thermal source produces is conducted to this heat dissipating layer, and this heat dissipating layer is used for and will be converted into far infrared by the heat that this substrate conducted and to external radiation.
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| CN200810135534A CN101660882A (en) | 2008-08-29 | 2008-08-29 | Manufacturing method and structure of radiating fins |
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| CN200810135534A CN101660882A (en) | 2008-08-29 | 2008-08-29 | Manufacturing method and structure of radiating fins |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192489A (en) * | 2010-03-11 | 2011-09-21 | 骆俊光 | Efficient heat radiation device |
| CN105344021A (en) * | 2015-11-07 | 2016-02-24 | 德化均能手造陶瓷有限公司 | Optical wafer for activating blood and dredging collaterals |
| TWI601935B (en) * | 2015-11-19 | 2017-10-11 | 遠東科技大學 | Thermally conductive structure, and method of reducing contact resistance at heat transfer interface |
| CN110099539A (en) * | 2018-01-30 | 2019-08-06 | 阙山腾 | Heat radiating fin structure and its manufacturing method |
| CN112105216A (en) * | 2019-05-30 | 2020-12-18 | Oppo广东移动通信有限公司 | Manufacturing method of radiator, radiator and electronic equipment |
-
2008
- 2008-08-29 CN CN200810135534A patent/CN101660882A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102192489A (en) * | 2010-03-11 | 2011-09-21 | 骆俊光 | Efficient heat radiation device |
| CN105344021A (en) * | 2015-11-07 | 2016-02-24 | 德化均能手造陶瓷有限公司 | Optical wafer for activating blood and dredging collaterals |
| TWI601935B (en) * | 2015-11-19 | 2017-10-11 | 遠東科技大學 | Thermally conductive structure, and method of reducing contact resistance at heat transfer interface |
| CN110099539A (en) * | 2018-01-30 | 2019-08-06 | 阙山腾 | Heat radiating fin structure and its manufacturing method |
| CN112105216A (en) * | 2019-05-30 | 2020-12-18 | Oppo广东移动通信有限公司 | Manufacturing method of radiator, radiator and electronic equipment |
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Application publication date: 20100303 |