Corrosion and Reliability of Electronic Materials and Devices: Proceedings of the Fourth International SymposiumRobert B. Comizzoli, Robert Peter Frankenthal, James Douglas Sinclair |
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accumulated acid activation addition alloys aluminum amount analysis applied atmospheric cause chemical chloride coating components concentration conductivity containing copper corrosion products corrosion resistance decrease defects degradation deposits determined developed device effect electrical electrochemical electrolyte electronic encapsulation environment equipment exposed exposure failure Figure film flow formation formed function glaze higher impedance increase initial interface kerf layer lead levels lines magnetic materials measured mechanism metal method mixed moisture observed obtained occurs oxide package particles passivation pattern performed period phase pitting plate pollutant polymer potential present protection reaction reduction relative humidity reliability resistance resistors samples shown shows significant silver solder solution step structure substrate sulfate sulfide sulfur surface Table temperature thickness thin various wettability wire
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Page 204 - Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company, for the United States Department of Energy's National Nuclear Security Administration.
Page 280 - Integrated circuit metal in the charged device model : Bootstrap heating, melt damage, and scaling laws," EOS/ESD Symposium Proceedings, pp.
Page 40 - JR Scully, DE Peebles, AD Romig, Jr., DR Frear, and CR Hills, Met.
Page 148 - G. Bitko, DJ Monk, T. Maudie, D. Stanerson, J. Wertz, J. Matkin, and S. Petrovic, "Analytical Techniques for Examining Reliability and Failure Mechanisms of Barrier Coating Encapsulated Silicon Pressure Sensors Exposed to Harsh Media," Micromachined Devices and Components II, Austin, TX, pp.
Page 279 - As electronic components use less material they become more sensitive to voltage and current variations. This increases their operational speed and functionality. Corrosion that was heretofore inconsequential now becomes a major factor in the current electronic components. These problems take on a myriad of new consequences. Of these new problems the tribo charging of differential surfaces can be a significant one.
Page 279 - To understand the importance of this increase in energy the same experiment was performed using peak current as a measuring parameter in relationship to time using a CDM model as a basis for calibration and computation. The results are shown in figure 3. One must take note that the Y axis units are plotted in a linear mode while the X axis are logarithmic.
Page 278 - This degradation in performance can be directly attributed to corrosion, and will cause either latent defects or more likely bit errors in digital communications. EXPERIMENTAL Sample Preparation Six copper coupon disks 2.0 cm diameter by 1 .5 mm thick of OHFC gage were used. The coupons were cleaned in a 1 to 1 nitric acid bath, etched, rinsed with distilled water, and flooded with methanol.
Page 5 - The extent of the attack on the Al matrix surrounding the inclusion, ie the trenches around the inclusions, varies considerably. This means the oxygen reduction occurs to a different extent on the different inclusions, which can easily be explained by the concept of a microelectrode array: at low rotation velocities the oxygen transport to the inclusions is limited and diffusion cones...
Page 277 - As a charged object increases it's insulation resistance raising the maximum voltage the energy of the discharge will grow exponentially as a discharge occurs through a grounded part of the sensitive circuit. If a discharge occurs at a lower potential less damage is done. Since a corroded surface will arc at a higher potential, a greater amount of damage will occur Another aspect of this account follows Ohms Law 7. Ohms Law states that...